Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Jul 6 - Jul 11
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Description
For Mobile Phone Motherboard CPU IC Repair Blade With HandleHONG HAI TONG Professional Phone Motherboard CPU IC glue removal blade set, used to disassemble layered chips and remove glue. Mobile phone motherboard CPU IC glue removal blade set. Features: 1# blade: mainly used to disassemble the small chip or remove the glue of the small chip. 2# blade: mainly used to disassemble large chips or remove the glue of large chips. 3# blade: mainly used for the disassembly and glue removal of double layer or single
HONG HAI TONG Professional Phone Motherboard CPU IC glue removal blade set, used to disassemble layered chips and remove glue. Mobile phone motherboard CPU IC glue removal blade set.
Features:
1# blade: mainly used to disassemble the small chip or remove the glue of the small chip.
2# blade: mainly used to disassemble large chips or remove the glue of large chips.
3# blade: mainly used for the disassembly and glue removal of double-layer or single-layer CPU chips.
4# blade: specially designed for Android fonts, and can also be used to disassemble other chips.
5# blade: used for chip hooking and scraping glue, suitable for small gaps and corners.
6# blade: mainly used to disassemble the Nand flash, baseband, WIFI IC.
Blade handle: imported material, high temperature resistance, no heat conduction, anti-static, light and flexible, easy to use.
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy